Title :
PVD Aluminium Nitride as Heat Spreader in SilicononGlass Technology
Author :
L. La Spina;H. Schellevis;N. Nenadovic;L.K. Nanver
Author_Institution :
DIMES, Delft Univ. of Technol.
fDate :
6/28/1905 12:00:00 AM
Abstract :
Physical-vapor-deposited aluminium nitride has been integrated in a silicon-on-glass NPN BJT process. Deposition conditions have been developed for which suitable electrical, mechanical and thermal properties are achieved. Electrothermal device characterization is used to demonstrate the effective heat spreading of this thin-film material
Keywords :
"Atherosclerosis","Aluminum","Electrothermal effects","Silicon","Conducting materials","Dry etching","Dielectrics and electrical insulation","Thermal conductivity","Tensile stress","Wet etching"
Conference_Titel :
Microelectronics, 2006 25th International Conference on
Print_ISBN :
1-4244-0117-8
DOI :
10.1109/ICMEL.2006.1650968
