DocumentCode
3622151
Title
Design and Simulation of Thick Film Thermistors Using Commercial Simulation Tools
Author
V. Maric;O. Aleksic;L. Zivanov
Author_Institution
Fac. of Tech. Sci., Novi Sad Univ.
fYear
2006
fDate
6/28/1905 12:00:00 AM
Firstpage
447
Lastpage
450
Abstract
Methods for predicting and analyzing the behavior of NTC thermistors have remained the same and they typically include accurate measurements of resistance and temperature, followed by curve-fitting methodologies for determining the relationship of temperature to resistance for similar thermistor devices. In this paper, new approach based on using commercial software tools was applied on the thick film segmented thermistor models. Obtained simulation results were compared with experimental results and validity of the adopted approach verified. Realized segmented thermistors were made of a low temperature NTC thick film paste NTC 3K3 95/2 with nanometer particle powder printed on alumina
Keywords
"Thick films","Thermistors","Temperature sensors","Electrical resistance measurement","Temperature measurement","Electrodes","Thermal resistance","Manufacturing","Curve fitting","Temperature control"
Publisher
ieee
Conference_Titel
Microelectronics, 2006 25th International Conference on
Print_ISBN
1-4244-0117-8
Type
conf
DOI
10.1109/ICMEL.2006.1650997
Filename
1650997
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