DocumentCode
3623766
Title
On the Modeling of Packages from Their Time Responses
Author
F. G. Canavero;S. Grivet-Talocia;H. Kruger;I. A. Maio;I. S. Stievano;P. Thoma
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
69
Lastpage
72
Keywords
"Packaging","Circuit simulation","Bandwidth","Transmission line matrix methods","Power system transients","Electromagnetic transients","Circuit testing","Electromagnetic scattering","Sampling methods","Electromagnetic fields"
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects, 6th IEEE Workshop on. Proceedings
Print_ISBN
0-7803-9821-1
Type
conf
DOI
10.1109/SPI.2002.258285
Filename
4027659
Link To Document