DocumentCode :
3623794
Title :
The Improvement of Signal Integrity (SI) according to The Location of Via in The Vicinity of A Slot in The Reference Plane
Author :
Tae Honjunho Lee;Junho Kim;Hyungsoo Kim;Pil Jung Jun;Joungho Kim
fYear :
2002
fDate :
6/24/1905 12:00:00 AM
Firstpage :
185
Lastpage :
188
Keywords :
"Printed circuits","Dielectric measurements","Digital integrated circuits","Signal design","Circuit simulation","Circuit testing","Noise reduction","Integrated circuit noise","Integrated circuit technology","Integrated circuit interconnections"
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects, 6th IEEE Workshop on. Proceedings
Print_ISBN :
0-7803-9821-1
Type :
conf
DOI :
10.1109/SPI.2002.258311
Filename :
4027692
Link To Document :
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