DocumentCode
3623794
Title
The Improvement of Signal Integrity (SI) according to The Location of Via in The Vicinity of A Slot in The Reference Plane
Author
Tae Honjunho Lee;Junho Kim;Hyungsoo Kim;Pil Jung Jun;Joungho Kim
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
185
Lastpage
188
Keywords
"Printed circuits","Dielectric measurements","Digital integrated circuits","Signal design","Circuit simulation","Circuit testing","Noise reduction","Integrated circuit noise","Integrated circuit technology","Integrated circuit interconnections"
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects, 6th IEEE Workshop on. Proceedings
Print_ISBN
0-7803-9821-1
Type
conf
DOI
10.1109/SPI.2002.258311
Filename
4027692
Link To Document