DocumentCode :
3624074
Title :
IIRW Discussion Group Summary : Interconnects
fYear :
2006
Firstpage :
221
Lastpage :
221
Keywords :
"Testing","Current density","Heating","Dielectrics","Metallization","Copper","Thermal stresses","Electromigration","Temperature","Samarium"
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2006 IEEE International
ISSN :
1930-8841
Print_ISBN :
1-4244-0296-4
Electronic_ISBN :
2374-8036
Type :
conf
DOI :
10.1109/IRWS.2006.305260
Filename :
4098737
Link To Document :
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