DocumentCode
3624480
Title
The Effect of Rapid Thermal Annealing on Oxygen Precipitation in Nitrogen Doped Silicon Substrate
Author
L´. Stuchlikova;L. Harmatha;M. Tapajna;P. Ballo;P. Pisecny;M. Benkovic;J. Jakabovic
Author_Institution
Faculty of Electrical Engineering and Information Technology, Slovak University of Technology, Ilkovi?ova 3, 812 19 Bratislava, Slovak Republic. e-mail: lubica.stuchlikova@stuba.sk
fYear
2006
Firstpage
43
Lastpage
46
Abstract
Nitrogen introduced into a silicon substrate by the Czochralski method brought about an increase in the density of Si-SiO2 interface traps and in the density of electrically active defects in Si by an enhanced nucleation of oxygen precipitates. Rapid thermal annealing above 800degC led to decomposition of NxOy clusters in the vicinity of the Si-SiO2 interface and to an increase of the width of the denuded zone
Keywords
"Rapid thermal annealing","Oxygen","Nitrogen","Silicon","Capacitance measurement","Capacitance-voltage characteristics","Gettering","Charge carriers","Energy measurement","Spectroscopy"
Publisher
ieee
Conference_Titel
Advanced Semiconductor Devices and Microsystems, 2006. ASDAM ´06. International Conference on
Print_ISBN
1-4244-0369-0
Type
conf
DOI
10.1109/ASDAM.2006.331149
Filename
4133073
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