Three Dimensional RC Model of Heat Transfer in Thick-Film Multilayer Structure

The complexity of heat exchange mechanisms in electronic circuits make the thermal analysis a complicated problem. In reality, only numerical calculations and specialized simulation programs can solve the systems of differential equations with very complicated boundary and initial conditions. The paper presents some aspects of describing of 3D thermal model of the thick-film multilayer structure with equivalent models (based on RC elements) which are used in temperature field simulation using PSPICE program.