• DocumentCode
    3625635
  • Title

    Reliability Concerns of Lead-free Solder Use in Aerospace Applications

  • Author

    Ilknur Baylakoglu

  • Author_Institution
    T?B?TAK-UZAY, Uzay Teknolojileri Ara?tirma Enstit?s?, (Space Technologies Research Institute), ODT? 06531 Ankara, Turkey, http://www.uzay.tubitak.gov.tr, ilknur.baylakoglu@uzay.tubitak.gov.tr
  • fYear
    2007
  • fDate
    6/1/2007 12:00:00 AM
  • Firstpage
    158
  • Lastpage
    164
  • Abstract
    In this paper, it has been provided the impact of lead free solder use in electronics to the aerospace electronics in the aerospace environment. These impacts especially have been faced in the areas of reliability, assembly methods, cost drivers, supply chain management, and alternative materials selection. Reliability will probably be the most significant factor for the aerospace industry if it converts to Pb free. So, the question has been addressed by focusing in the reliability issues in this paper. Some information has been summarized from other studies to give an idea and references.
  • Keywords
    "Environmentally friendly manufacturing techniques","Lead","Aerospace materials","Aerospace electronics","Aerospace industry","Materials reliability","Assembly","Costs","Driver circuits","Supply chain management"
  • Publisher
    ieee
  • Conference_Titel
    Recent Advances in Space Technologies, 2007. RAST ´07. 3rd International Conference on
  • Print_ISBN
    1-4244-1056-8
  • Type

    conf

  • DOI
    10.1109/RAST.2007.4283969
  • Filename
    4283969