• DocumentCode
    3625675
  • Title

    Application of RC Equivalent Networks to Modelling of Nonlinear Thermal Phenomena

  • Author

    M. Kaminski;M. Janicki;A. Napieralski

  • Author_Institution
    Department of Microelectronics and Computer Science, Technical University of Lodz, Politechniki 11, 93-590 Lodz, Poland. E-mail: kaminski@dmcs.pl
  • fYear
    2007
  • fDate
    6/1/2007 12:00:00 AM
  • Firstpage
    357
  • Lastpage
    362
  • Abstract
    The main goal of this paper is to present an extension of a numerical solver dedicated to thermal simulation of electronic structures. This solver implements the finite difference method and employs the RC equivalent network approach. The hereby-proposed extension renders possible thermal simulation taking into account non-linear cases when material thermal properties and heat transfer coefficient values depend on temperature. For this purpose, the standard equivalent RC circuit method has been significantly modified. All the required modifications are presented in this paper in detail. Additionally, the differences between the results obtained with both the linear and non-linear simulators have been compared and discussed based on the examples of selected test structures.
  • Keywords
    "Heat transfer","Circuit simulation","Differential equations","Partial differential equations","Finite difference methods","Temperature dependence","Temperature distribution","Thermal conductivity","Computational modeling","Thermal management of electronics"
  • Publisher
    ieee
  • Conference_Titel
    Mixed Design of Integrated Circuits and Systems, 2007. MIXDES ´07. 14th International Conference on
  • Print_ISBN
    83-922632-4-3
  • Type

    conf

  • DOI
    10.1109/MIXDES.2007.4286184
  • Filename
    4286184