Title :
Singular Value Based Model Order Reduction for Interconnect ARX Modelling
Author :
Lj. Radic-Weissenfeld;C. Wiegand;C. Hedayat;W. Mathis;W. John
Author_Institution :
Leibniz Univ. of Hannover/FhG IZM ASE, Hannover
fDate :
7/1/2007 12:00:00 AM
Abstract :
This paper presents the abstract modelling of packages and high density interconnections, in order to build a behavioral model knowing very few information. The approach is based on combining black box modelling and order reduction. The package is divided into single block models that are defined from arbitrary input and output signals. Using black box modelling numerically effective simulations of the interconnection is possible. Balanced form of high order model of interconnection can be easily reduced. The dominant states essential for the order reduction procedure are recognized in the model singular values issued from the observability and the controllability Gramians. On this way a efficient signal integrity analysis can be fast and easily achieved.
Keywords :
"Integrated circuit interconnections","Transfer functions","Least squares methods","Signal analysis","Integrated circuit packaging","Electromagnetic compatibility","Numerical models","Numerical simulation","Observability","Controllability"
Conference_Titel :
Electromagnetic Compatibility, 2007. EMC 2007. IEEE International Symposium on
Print_ISBN :
1-4244-1349-4
Electronic_ISBN :
2158-1118
DOI :
10.1109/ISEMC.2007.150