DocumentCode :
3626901
Title :
An approach to building more compact power electronic converters
Author :
Jelena Popovic-Gerber;Mark Gerber;Braham Ferreira
Author_Institution :
European Centre for Power Electronics (ECPE) Landgrabenstrasse 94 Nuremberg, Germany
fYear :
2007
Firstpage :
1
Lastpage :
10
Abstract :
An approach to constructing high power density power electronic converters is presented. The largest volume contributors in state-of-the-art construction technology are discussed. A concept to reduce the volume of converters by means of increasing the level of integration and better thermal management is introduced. Hybrid integration of power electronic circuits through partitioning the circuit into sub-circuits on the basis of components´ characteristics such as heat density, volumetric aspects and cost per volume is discussed. These sub-circuits are referred to as Integrated Power Electronic Modules (IPEMs) and are manufactured in suitable integration technologies. The concept is applied to a case study, a converter for 2 kW AC drive, as part of the demonstrator program running under European Centre for Power Electronics (ECPE) "Industrial Drives - System Integration". The electrical circuit schematic of the converter is partitioned into three IPEMs: Planar Ceramic IPEM, Planar PCB IPEM and 3D Passive IPEM. Suitable technologies for implementation of each IPEM and their volume reduction potential are discussed.
Keywords :
"Power electronics","Packaging","Circuits","Costs","Thermal management","Production","Electronics industry","Manufacturing industries","Assembly","Semiconductor device manufacture"
Publisher :
ieee
Conference_Titel :
Power Electronics and Applications, 2007 European Conference on
Type :
conf
DOI :
10.1109/EPE.2007.4417493
Filename :
4417493
Link To Document :
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