• DocumentCode
    3627081
  • Title

    Implementation of Ecological Technologies in Electronics Industry based on RESPLATEPE Research Project

  • Author

    N. D. Codreanu;I. Plotog;P. Svasta;C. Turcu;G. Varzaru;D. Pitica;M. Gavan;A. Bara;C. Farcas; Al Marin;T.C. Cucu

  • Author_Institution
    POLITEHNICA University of Bucharest, Center of Technological Electronics and Interconnection Techniques (UPB-CETTI), Splaiul Independentei no. 313, Bucharest, Romania. e-mail: norocel.codreanu@cetti.ro
  • fYear
    2007
  • fDate
    5/1/2007 12:00:00 AM
  • Firstpage
    263
  • Lastpage
    268
  • Abstract
    The paper presents the applied research performed in the frame of RESPLATEPE Romanian CEEX national project destined to implementation of ecological technologies in electronics industry, based on based on RoHS and WEEE directives [3]. The work represents a multi-criteria approach in electronics packaging and emphasizes the activity of eight research partners involved in various phases of electronic manufacturing process. Under work are activities regarding electrical, rheological, climatic, and mechanical testing of experimental ecological modules and structures (the relative humidity controller presented in this contribution being one example) developed in the first stage. After them, the team will perform investigations of signals parameters, environmental factors and interconnection technologies influences on ecological electronic modules developed or destined for future development.
  • Keywords
    "Electronics industry","Environmentally friendly manufacturing techniques","Lead","Consumer electronics","Assembly","Marine technology","Electronics packaging","Testing","Metallization","Copper alloys"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 30th International Spring Seminar on
  • ISSN
    2161-2528
  • Print_ISBN
    978-1-4244-1217-4
  • Electronic_ISBN
    2161-2064
  • Type

    conf

  • DOI
    10.1109/ISSE.2007.4432860
  • Filename
    4432860