DocumentCode
3627359
Title
Copper-filled macroporous Si for microchannel heat sink tecnology
Author
Filimon Zacharatos;Androula Nassiopoulou
Author_Institution
IMEL, NCSR ?Demokritos?, Greece
fYear
2007
Firstpage
60
Lastpage
60
Keywords
"Microchannel","Heat sinks","Printing","Publishing"
Publisher
ieee
Conference_Titel
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Print_ISBN
978-2-35500-002-7
Type
conf
DOI
10.1109/THERMINIC.2007.4451747
Filename
4451747
Link To Document