• DocumentCode
    3627365
  • Title

    Inverse damage detection in IC packaging component

  • Author

    Chun-Yin Wu; Wen-Chang Lin

  • Author_Institution
    Department of Mechanical Engineering, Tatung University, Taipei, 104, Taiwan
  • fYear
    2007
  • Firstpage
    214
  • Lastpage
    214
  • Keywords
    "Integrated circuit packaging","Mechanical engineering","Cities and towns","Printing","Publishing"
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
  • Print_ISBN
    978-2-35500-002-7
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2007.4451780
  • Filename
    4451780
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3627365