Title :
Vibration combined high Temperature Cycle Tests for capacitive MEMS accelerometers
Author :
Z. Szucs;G. Nagy;S. Hodossy;M. Rencz;A. Poppe
Author_Institution :
Budapest University of Technology and Economics, Department of Electron Devices, H-1521, Goldmann Gy?rgy t?r 3., Hungary
Abstract :
In this paper vibration combined high temperature cycle tests for packaged capacitive SOI-MEMS accelerometers are presented. The aim of these tests is to provide useful Design for reliability information for MEMS designers. A high temperature test chamber and a chopper-stabilized read-out circuitry were designed and realized at BME-DED. Twenty thermal cycles of combined temperature cycle test and fatigue vibration test has been carried out on 5 samples. Statistical evaluation of the test results showed that degradation has started in 3 out of the 5 samples.
Keywords :
"Micromechanical devices","Accelerometers","Circuit testing","Temperature sensors","Acceleration","Vibrations","Fatigue","Temperature dependence","Integrated circuit reliability","Electron devices"
Conference_Titel :
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Print_ISBN :
978-2-35500-002-7
DOI :
10.1109/THERMINIC.2007.4451781
