Title :
Reliability of lead free solder SAC 305 for chip components depending on various factors
Author :
O. Russkikh;J. Sandera
Author_Institution :
Brno University of Technology, Faculty of Electrical Engineering and Communication, Department of Microelectronics, ?doln? 53, 602 00, Czech Republic
Abstract :
The paper gives results of practical tests concerning reliability of solder joints forged with the lead free solder SAC305. Various finishing, bending pads and methods of soldering were tested.
Keywords :
"Environmentally friendly manufacturing techniques","Lead","Soldering","Temperature","Packaging","Printed circuits","Testing","Stress","Ceramics","Inorganic materials"
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Print_ISBN :
978-1-4244-2813-7
DOI :
10.1109/ESTC.2008.4684393
