• DocumentCode
    3629680
  • Title

    Reliability of lead free solder SAC 305 for chip components depending on various factors

  • Author

    O. Russkikh;J. Sandera

  • Author_Institution
    Brno University of Technology, Faculty of Electrical Engineering and Communication, Department of Microelectronics, ?doln? 53, 602 00, Czech Republic
  • fYear
    2008
  • Firstpage
    471
  • Lastpage
    476
  • Abstract
    The paper gives results of practical tests concerning reliability of solder joints forged with the lead free solder SAC305. Various finishing, bending pads and methods of soldering were tested.
  • Keywords
    "Environmentally friendly manufacturing techniques","Lead","Soldering","Temperature","Packaging","Printed circuits","Testing","Stress","Ceramics","Inorganic materials"
  • Publisher
    ieee
  • Conference_Titel
    Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
  • Print_ISBN
    978-1-4244-2813-7
  • Type

    conf

  • DOI
    10.1109/ESTC.2008.4684393
  • Filename
    4684393
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3629680