DocumentCode
3633296
Title
Bonding in 3D structure
Author
Petr Kosina;Edita Hejatkova;Josef Sandera
Author_Institution
Department of Microelectronic, Brno University of Technology, ?doln? 53, 602 00 Brno, Czech Republic
fYear
2008
fDate
5/1/2008 12:00:00 AM
Firstpage
511
Lastpage
513
Abstract
This paper is focused on the creation of bonding on a ceramic substrate medium, which can be applied in 3D structure (LTCC-low temperature co-fired ceramic), and on the measurement of its reliability. One of the methods which can be used to create a conductive connection between particular layers is described. The method enables to create complex circuitry and to increase the density of entities on the surface. The aim is to create the conductive connection of high reliability, because can not be nondestructive dissolution resultant structure.
Keywords
"Bonding","Printing","Temperature","Ceramics","Substrates","Technological innovation","Printed circuits","Thin film circuits","Thick films","Thickness measurement"
Publisher
ieee
Conference_Titel
Electronics Technology, 2008. ISSE ´08. 31st International Spring Seminar on
ISSN
2161-2528
Print_ISBN
978-1-4244-3973-7;978-1-4244-3972-0
Electronic_ISBN
2161-2064
Type
conf
DOI
10.1109/ISSE.2008.5276619
Filename
5276619
Link To Document