• DocumentCode
    3633298
  • Title

    Impact of solder pad shape on lead-free solder joint reliability

  • Author

    Cyril Vasko;Marek Novotny;Ivan Szendiuch

  • Author_Institution
    Department of Microelectronics, Brno University of Technology, Czech Republic
  • fYear
    2008
  • Firstpage
    433
  • Lastpage
    445
  • Abstract
    This paper deals with hand lead-free soldering process optimization. The work is focused on the impact of solder pads shape in combination with solder pads finish on lead-free solder joints reliability.
  • Keywords
    "Shape","Environmentally friendly manufacturing techniques","Lead","Soldering","Testing","Thermal stresses","Surface finishing","Mechanical factors","Electric shock","Manufacturing processes"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 2008. ISSE ´08. 31st International Spring Seminar on
  • ISSN
    2161-2528
  • Print_ISBN
    978-1-4244-3973-7;978-1-4244-3972-0
  • Electronic_ISBN
    2161-2064
  • Type

    conf

  • DOI
    10.1109/ISSE.2008.5276645
  • Filename
    5276645
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3633298