DocumentCode :
3634862
Title :
Mathematically simulated process of evaporation of thin NiCr films
Author :
Pavel Mach;Tomáš Rozkošný;David Bušek
Author_Institution :
Department of Electrotechnology, Faculty of Electrical Engineering, Czech Technical University in Prague, Prague 6, Czech Republic
fYear :
2009
Firstpage :
211
Lastpage :
214
Abstract :
Process of evaporation of thin NiCr resistive films on glass substrates has been simulated using DOE. The resistance of evaporated films has been calculated using a mathematical model based on three technological factors: the temperature of the substrate, the pressure and the time of evaporation. The model has been found using factorial experiments of the type 23. It has been found very good correspondence between the resistance values calculated using the model and found experimentally.
Keywords :
"Substrates","Sputtering","Transistors","Mathematical model","Resistors","Fabrication","Chemical technology","Electronics packaging","Glass","US Department of Energy"
Publisher :
ieee
Conference_Titel :
Design and Technology of Electronics Packages, (SIITME) 2009 15th International Symposium for
Print_ISBN :
978-1-4244-5132-6
Type :
conf
DOI :
10.1109/SIITME.2009.5407372
Filename :
5407372
Link To Document :
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