• DocumentCode
    3634950
  • Title

    Characterization of integrated thin film Pt heater and temperature sensors on Si platform

  • Author

    Drago Resnik;D. Vrtačnik;U. Aljančič;M. Možek;B. Pečar;S. Penič;S. Amon

  • Author_Institution
    Laboratory of Microsensor Structures and Electronics Faculty of Electrical Engineering, University of Ljubljana, Trzaska 25 Ljubljana 1000, Slovenia
  • fYear
    2009
  • Firstpage
    4014
  • Lastpage
    4019
  • Abstract
    In this paper the design, fabrication methods and characterization of thin film meandered Pt resistive heater (size 20 ? 20 mm2) with integrated Pt sensors on Si platform is presented. Pt heaters and temperature sensors were fabricated simultaneously by DC sputtering method. It was found that the fabrication process has significant influence on the electrical properties of the realized thin film resistive layers, which also explains the discrepancies between the calculated and measured values that were obtained during this work. Annealing temperature of the Pt layers was found to influence significantly the final resistance of the deposited layer and was performed at 500?C. To reduce the heat loss, the heater and temperature sensors were covered by Pyrex glass with prefabricated cavity. By this new approach, the power consumption was reduced due to improved thermal insulation. A comparative study was performed and showed that we can decrease the power consumption by more than 25% only by this approach. Measured temperature coefficient of resistance (TCR) for temperature sensors and the heater was between 1400-1700 ppm and showed that also the heater can be used as temperature sensing element.
  • Keywords
    "Semiconductor thin films","Thin film sensors","Temperature sensors","Sputtering","Fabrication","Electrical resistance measurement","Energy consumption","Temperature measurement","Resistance heating","Design methodology"
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics, 2009. IECON ´09. 35th Annual Conference of IEEE
  • ISSN
    1553-572X
  • Print_ISBN
    978-1-4244-4648-3
  • Type

    conf

  • DOI
    10.1109/IECON.2009.5415344
  • Filename
    5415344