• DocumentCode
    3634957
  • Title

    Finite Element simulation of inkjet printed strain gage on polyimide substrates applied to flexible boards

  • Author

    Edson R. Silva;W. C. Oliveira;L.O. Arruda;R Bonadiman;J. Quintero;R. Mancosu;J. M. Silva Neto;Edson Silva

  • Author_Institution
    Instituto Nokia de Tecnologia - INdT, Brazil
  • fYear
    2009
  • Firstpage
    607
  • Lastpage
    611
  • Abstract
    In this present work simulation models were obtained in order to develop tools for early stages of design of a new strain gauge by numerical modeling. The strain deformation was extracted by FEM simulation. Moreover, a correlation with experimental results was established in order to understand the efficiency of FEM results. It was observed that the finite element method is an adequate methodology to evaluate the strain-stress behavior of printed strain gauge in flexible structure. Moreover, the printed strain gauge found to be a suitable technology to be applied in flexible boards. Therefore, it could be applied as a direct method to measure strain deformation in flexible printed boards (FPCBs). It was also observed that, in an early product design stage, the FEM could be applied to simulate printed strain gauge during mechanical strain tests.
  • Keywords
    "Finite element methods","Capacitive sensors","Polyimides","Strain measurement","Consumer electronics","Deformable models","Mechanical sensors","Mechanical factors","Circuit testing","Mechanical variables measurement"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2009. EPTC ´09. 11th
  • Print_ISBN
    978-1-4244-5099-2
  • Type

    conf

  • DOI
    10.1109/EPTC.2009.5416476
  • Filename
    5416476