DocumentCode :
3635221
Title :
Temperature dependent thermal resistance in power LED assemblies and a way to cope with it
Author :
Andr?s Poppe;G?bor Moln?r;Tam?s Temesv?lgyi
Author_Institution :
Mentor Graphics MicReD Division, Budapest XI, Infopark D, G?bor D?nes utca 2, H-1117 Hungary
fYear :
2010
Firstpage :
283
Lastpage :
288
Abstract :
Different high-end white power LEDs from different LED vendors were studied. The aim of the study was to find the optimal choice of LEDs and thermal management solutions for a street-lighting application. The primary concern was the (real) junction-to-heatsink thermal resistance of the LED or LED assembly and the real junction temperature and the actual light output of the individual LEDs under test. Since in many cases the junction-to-heatsink thermal resistance showed temperature dependence, like-with-like comparison in terms of light output characteristics was done as function of the real junction temperature instead of the reference temperature.
Keywords :
"Thermal resistance","Temperature dependence","Light emitting diodes","Assembly","Thermal management","LED lamps","Standardization","Electric resistance","Graphics","Power generation economics"
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE
ISSN :
1065-2221
Print_ISBN :
978-1-4244-9458-3
Type :
conf
DOI :
10.1109/STHERM.2010.5444276
Filename :
5444276
Link To Document :
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