• DocumentCode
    3635221
  • Title

    Temperature dependent thermal resistance in power LED assemblies and a way to cope with it

  • Author

    Andr?s Poppe;G?bor Moln?r;Tam?s Temesv?lgyi

  • Author_Institution
    Mentor Graphics MicReD Division, Budapest XI, Infopark D, G?bor D?nes utca 2, H-1117 Hungary
  • fYear
    2010
  • Firstpage
    283
  • Lastpage
    288
  • Abstract
    Different high-end white power LEDs from different LED vendors were studied. The aim of the study was to find the optimal choice of LEDs and thermal management solutions for a street-lighting application. The primary concern was the (real) junction-to-heatsink thermal resistance of the LED or LED assembly and the real junction temperature and the actual light output of the individual LEDs under test. Since in many cases the junction-to-heatsink thermal resistance showed temperature dependence, like-with-like comparison in terms of light output characteristics was done as function of the real junction temperature instead of the reference temperature.
  • Keywords
    "Thermal resistance","Temperature dependence","Light emitting diodes","Assembly","Thermal management","LED lamps","Standardization","Electric resistance","Graphics","Power generation economics"
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4244-9458-3
  • Type

    conf

  • DOI
    10.1109/STHERM.2010.5444276
  • Filename
    5444276