Title :
Performance and characterization of MMIC phase shifter with wire bonds interconnections
Author_Institution :
Telecommunication Research Institute, PIT S.A, Warsaw, Poland
Abstract :
This paper presents some aspects of bond wire interconnections and its affect on the performance of a 6-bit phase shifter. The phase shifter operates in S-band and was connected to Rogers RO4003 substrate by the means of ball bonds. Discontinuities introduced by the interconnections were modeled as a low pass network. This non-optimal bonding worsened scattering parameters of the phase shifter by ~ 15%.
Keywords :
"MMICs","Phase shifters","Wire","Integrated circuit interconnections","Bonding","Inductance","Impedance","Packaging","Scattering parameters","Electromagnetic heating"
Conference_Titel :
Microwave Radar and Wireless Communications (MIKON), 2010 18th International Conference on
Print_ISBN :
978-1-4244-5288-0