DocumentCode :
3637100
Title :
Performance and characterization of MMIC phase shifter with wire bonds interconnections
Author :
Piotr Szymański
Author_Institution :
Telecommunication Research Institute, PIT S.A, Warsaw, Poland
fYear :
2010
Firstpage :
1
Lastpage :
4
Abstract :
This paper presents some aspects of bond wire interconnections and its affect on the performance of a 6-bit phase shifter. The phase shifter operates in S-band and was connected to Rogers RO4003 substrate by the means of ball bonds. Discontinuities introduced by the interconnections were modeled as a low pass network. This non-optimal bonding worsened scattering parameters of the phase shifter by ~ 15%.
Keywords :
"MMICs","Phase shifters","Wire","Integrated circuit interconnections","Bonding","Inductance","Impedance","Packaging","Scattering parameters","Electromagnetic heating"
Publisher :
ieee
Conference_Titel :
Microwave Radar and Wireless Communications (MIKON), 2010 18th International Conference on
Print_ISBN :
978-1-4244-5288-0
Type :
conf
Filename :
5540378
Link To Document :
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