• DocumentCode
    3637363
  • Title

    Lean randomization and exception handling

  • Author

    Jan Rothe;Robert Barlović;Andreas Becker;Raymond Goss;Dirk Grossmann;Wolfgang Jäckel;Sebastian Knappe;Thomas Kowtsch;Stephan Melzig;Mark Reiche;Uwe Schulze;Heiko Wagner;Hermann Weindl;Daniel Zschäbitz

  • Author_Institution
    GLOBALFOUNDRIES, Wilschdorfer Landstraß
  • fYear
    2010
  • Firstpage
    236
  • Lastpage
    240
  • Abstract
    In recent years, randomization of process order as well as randomization of the wafer map in the cassettes delivering the wafers was increasingly used to be able to correlate yield variations with specific segments of the process flow (see [1] and [2]), as well as to reduce yield influences on specific wafer positions such as top and bottom of the wafer cassette. Many randomization efforts relied on wafer sorter based randomization, which costs cycle time and wafer sorter capacity. In this paper, we describe how randomization of both process sequence as well as wafer map changes can be implemented on process equipment as part of normal processing. This kind of randomization does not add cycle time and does not require wafer sorters and will therefore be called lean randomization. We will also describe some of the most important exceptions that can occur when implementing lean randomization and we will discuss how a fab can deal with those exceptions.
  • Keywords
    "Process control","Metrology","Manufacturing","Standards","Robots","Floors","Qualifications"
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4244-6517-0
  • Type

    conf

  • DOI
    10.1109/ASMC.2010.5551456
  • Filename
    5551456