DocumentCode
3637542
Title
A 5.8mW 3GPP-LTE compliant 8×8 MIMO sphere decoder chip with soft-outputs
Author
Chia-Hsiang Yang;Tsung-Han Yu;Dejan Marković
Author_Institution
Electrical Engineering Department, University of California, Los Angeles, USA
fYear
2010
Firstpage
209
Lastpage
210
Abstract
A MIMO chip for 3GPP-LTE standard and beyond is described. The chip implements sphere decoding algorithm with 16-core architecture. The chip is flexible to support multiple configurations: antenna arrays from 2×2 to 8×8, modulations from BPSK to 64QAM, FFT sizes from 128 to 2048 and hard/soft outputs. The chip dissipates 5.8mW for the 3GPP-LTE standard in 3.35mm2 area in 65nm CMOS.
Keywords
"MIMO","Decoding","Registers","Computer architecture","Kernel","Antenna arrays"
Publisher
ieee
Conference_Titel
VLSI Circuits (VLSIC), 2010 IEEE Symposium on
Print_ISBN
978-1-4244-5454-9
Type
conf
DOI
10.1109/VLSIC.2010.5560294
Filename
5560294
Link To Document