• DocumentCode
    3637560
  • Title

    An h-adaptive stochastic collocation method for stochastic EMC/EMI analysis

  • Author

    Abdulkadir C. Yücel;Hakan Bağcı;Eric Michielssen

  • Author_Institution
    Department of Electrical Engineering and Computer Science, University of Michigan, at Ann Arbor, Ann Arbor, MI 48109, USA
  • fYear
    2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The analysis of electromagnetic compatibility and interference (EMC/EMI) phenomena is often fraught by randomness in a system´s excitation (e.g., the amplitude, phase, and location of internal noise sources) or configuration (e.g., the routing of cables, the placement of electronic systems, component specifications, etc.). To bound the probability of system malfunction, fast and accurate techniques to quantify the uncertainty in system observables (e.g., voltages across mission-critical circuit elements) are called for. Recently proposed stochastic frameworks [1–2] combine deterministic electromagnetic (EM) simulators with stochastic collocation (SC) methods that approximate system observables using generalized polynomial chaos expansion (gPC) [3] (viz. orthogonal polynomials spanning the entire random domain) to estimate their statistical moments and probability density functions (pdfs). When constructing gPC expansions, the EM simulator is used solely to evaluate system observables at collocation points prescribed by the SC-gPC scheme. The frameworks in [1–2] therefore are non-intrusive and straightforward to implement. That said, they become inefficient and inaccurate for system observables that vary rapidly or are discontinuous in the random variables (as their representations may require very high-order polynomials).
  • Keywords
    "Electromagnetic interference","Electromagnetic compatibility","Tensile stress","RLC circuits","Polynomials","Random variables","Adaptation model"
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium (APSURSI), 2010 IEEE
  • ISSN
    1522-3965
  • Print_ISBN
    978-1-4244-4967-5
  • Electronic_ISBN
    1947-1491
  • Type

    conf

  • DOI
    10.1109/APS.2010.5562200
  • Filename
    5562200