An advanced endpoint solution for <1% open area applications; contact and via

An advanced endpoint detection system, the EndPoint Plus/sup TM/ (EPP/sup TM/) from Lam Research Corporation, has recently been optimized and proven in production on Rainbow/sup TM/ 4520 oxide etchers at IBM Microelectronics in Essex Junction, Vermont. This paper discusses the endpoint detection and control system used on wafers with exposed etch areas ranging from 0.5% to 15%. The system correctly identified endpoint despite modern semiconductor fabrication requirements that make detection difficult. Evaluation showed that using automated endpoint detection and control increased throughput and reduced rework across a wide range of etch applications in volume manufacturing.