DocumentCode :
3640929
Title :
3D-TSV overview
Author :
Sitaram Arkalgud
Author_Institution :
3D Interconnect, SEMATECH, USA
fYear :
2010
Firstpage :
1
Lastpage :
38
Keywords :
"Three dimensional displays","Bonding","Integrated circuit interconnections","Through-silicon vias","Wire","Stacking","Silicon"
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing (ISSM), 2010 International Symposium on
ISSN :
1523-553X
Print_ISBN :
978-1-4577-0392-8
Type :
conf
Filename :
5750204
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3640929
