• DocumentCode
    3640929
  • Title

    3D-TSV overview

  • Author

    Sitaram Arkalgud

  • Author_Institution
    3D Interconnect, SEMATECH, USA
  • fYear
    2010
  • Firstpage
    1
  • Lastpage
    38
  • Keywords
    "Three dimensional displays","Bonding","Integrated circuit interconnections","Through-silicon vias","Wire","Stacking","Silicon"
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing (ISSM), 2010 International Symposium on
  • ISSN
    1523-553X
  • Print_ISBN
    978-1-4577-0392-8
  • Type

    conf

  • Filename
    5750204
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3640929