Title :
3D heterogeneous integration for novel functionality
Author :
Montserrat Fernández-Bolaños;Adrian M Ionescu
Abstract :
Presents a collection of slides covering the following topics: 3D heterogenous integration; Moore´s law; RF MEMS; antenna; TSV; carbon nanotubes; and silicon nanowires.
Keywords :
"Three dimensional displays","Sensors","Micromechanical devices","System-on-a-chip","Through-silicon vias","Radio frequency","Wireless sensor networks"
Conference_Titel :
3D Systems Integration Conference (3DIC), 2010 IEEE International
Print_ISBN :
978-1-4577-0526-7
DOI :
10.1109/3DIC.2010.5751423