DocumentCode
3642575
Title
Thermal decomposition of silicon-rich oxides deposited by the LPCVD method
Author
Davor Ristić;Mile Ivanda;Krešimir Furić;Alessandro Chiasera;Enrico Moser;Maurizio Ferrari
Author_Institution
SMFO Lab, Istituto di fotonica e nanotecnologie (IFN-CRN) Via alia Cascata 56/C, Povo, 38123 Trento, Italy
fYear
2011
fDate
5/1/2011 12:00:00 AM
Firstpage
25
Lastpage
26
Abstract
Silicon-rich oxide (SiOx, 0<;x<;2) thin films were deposited using the Low Pressure Chemical Vapor Deposition (LPCVD) method at temperature of 570 °C using silane (SiH4) and oxygen as the reactant gasses. The films were annealed at temperatures of 800 °C, 900 °C, 1000 °C and 1100 °C to induce the separation of excess silicon in the SiOx films into nanosized crystalline silicon particles inside an amorphous SiOx matrix. The size of the silicon particles was determined using Raman spectroscopy.
Keywords
"Silicon","Annealing","Phonons","Optical films","Raman scattering","Solids"
Publisher
ieee
Conference_Titel
MIPRO, 2011 Proceedings of the 34th International Convention
Print_ISBN
978-1-4577-0996-8
Type
conf
Filename
5967016
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