DocumentCode

3644755

Title

TSV modeling (T-VI)

Author

Zhen Mu;Sheldon Tan

Author_Institution

Mentor Garphics Corporation, San Jose, USA

fYear

2011

Firstpage

99

Lastpage

100

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on

ISSN

pending

Print_ISBN

978-1-4244-9398-2

Type

conf

DOI

10.1109/EPEPS.2011.6100197

Filename

6100197