Influence of different type protective layer on silver metallic nanoparticles for Ink-Jet printing technique

Very quick development of the new techniques for making printed circuits (R2R, Ink Jet) makes possible for using as a base substrate - flexible plastic foils. This solution are giving very strong requirements for printing process what is connected with substrate foils parameters. One of the most important problem is as low as possible processing temperature for obtaining electrical conductivity for printed structures. At the present moment takes that the temperature of the processing should not be higher as 150C. The most popular conductive fillers for printing applications are silver metallic nanoparticles [1]. As well know, nanosize silver doesn´t exist without protection layer around each particles. Nanosilver must be encapsulated by a protective layer of organic type dispersants to avoid aggregation. When metallic nanoparticle inks are heated, the dispersants should be effectively removed, allowing the remaining active metallic nanoparticles to be successfully sintered [2]. In the article we´ll present several types of nanosilver´s with different coating shells, for example polymer type, carboxylate and others. The results of quantitative investigations will be introduced for various type of coating and their dynamics of removing in the function of the temperature and time.