Paths of the heat flow from semiconductor devices to the surrounding

In the paper paths of the heat flow generated inside a semiconductor structure to the surrounding are considered. On the basis of the literature information, typical construction of semiconductor devices cooling systems are analysed. Apart from this, the results of measurements of the thermal resistance and transient thermal impedance of such devices illustrating the influence of some factors on the value of thermal parameters are discussed. The general form of the device thermal model including the multipath of the heat flow and thermal properties of the elements of the heat flow path is proposed.