Title :
Universal DSP module implemented by SMT area array packaging technology
Author :
D. Jovanovic;M.D. Lutovac;R. Djenic
Author_Institution :
Telecommun. & Electron. Inst., Belgrade, Yugoslavia
Abstract :
A new universal digital signal processing (DSP) module is implemented by SMT-Area Array Packaging Technology. The new DSP module is designed to fulfilled reconfigurable requirements and short time-to-market and for low volume low-cost custom applications.
Keywords :
"Digital signal processing","Surface-mount technology","Electronics packaging","Digital signal processing chips","Assembly","Lead","Application specific integrated circuits","Signal design","Pins","Laboratories"
Conference_Titel :
Microelectronics, 1997. Proceedings., 1997 21st International Conference on
Print_ISBN :
0-7803-3664-X
DOI :
10.1109/ICMEL.1997.625286
