• DocumentCode
    3647837
  • Title

    Universal DSP module implemented by SMT area array packaging technology

  • Author

    D. Jovanovic;M.D. Lutovac;R. Djenic

  • Author_Institution
    Telecommun. & Electron. Inst., Belgrade, Yugoslavia
  • Volume
    1
  • fYear
    1997
  • Firstpage
    435
  • Abstract
    A new universal digital signal processing (DSP) module is implemented by SMT-Area Array Packaging Technology. The new DSP module is designed to fulfilled reconfigurable requirements and short time-to-market and for low volume low-cost custom applications.
  • Keywords
    "Digital signal processing","Surface-mount technology","Electronics packaging","Digital signal processing chips","Assembly","Lead","Application specific integrated circuits","Signal design","Pins","Laboratories"
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 1997. Proceedings., 1997 21st International Conference on
  • Print_ISBN
    0-7803-3664-X
  • Type

    conf

  • DOI
    10.1109/ICMEL.1997.625286
  • Filename
    625286