Study of glass transition temperature of electrically conductive adhesives

Isotropic electrically conductive adhesive with epoxy matrix filled with silver flakes was modified with addition of multi-walled silver nanotubes and with silver nanoparticles. Samples of adhesive as received and modified adhesive were formed. Part of the samples was aged in increased temperature, in increased humidity and in elevated temperature combined with humidity. Glass transition temperature of samples was investigated using dynamic thermo-mechanical analysis in penetration mode. It was found that the glass transition temperature increases after temperature aging for all - modified and non-modified formulations. The reason is additional curing of adhesive during temperature ageing. Changes of the glass transition temperature after humidity and temperature/humidity aging are negative and the reason will still be deeper examined.