Laboratory platform for board temperature profiling inside reflow ovens

The paper presents the research and development activities performed by authors for the conception and realization of a laboratory platform destined for temperature profiling at the level of the printed circuit board (PCB) during the soldering process inside reflow ovens [1], [3]. The platform was developed in the last months, being based on contact temperature measurement (with K thermocouples). The radio communication [5] offers a reliable data transfer to a computer, plotting the thermal profile, representing the relationship between temperature and time during the heating of PCB for the components´ soldering process. The platform consists in two main blocks: the acquisition system, which travels inside the oven together with the PCB, and the receiver system, which receives the radio signals from the reflow oven and transfers towards a computer the technical data for graphical displaying and further investigation. This contribution is focused only to the first system/block, which works in much harsher conditions than the second one.