• DocumentCode
    3649507
  • Title

    Thermal modeling of through hole capacitors

  • Author

    Jánó Rajmond;Pitică Dan

  • Author_Institution
    Applied Electronics Department, Technical University of Cluj-Napoca, Cluj-Napoca, Romania
  • fYear
    2012
  • Firstpage
    227
  • Lastpage
    232
  • Abstract
    Through the course of this paper transient thermal conditions were investigated for through hole capacitor models built in SolidWorks. Firstly, the influences of the shape, casing material are determined, after which lifelike models for aluminum electrolytic, ceramic and plastic film capacitors are built and their efficiency regarding forced cooling and thermal power dissipation is investigated.
  • Keywords
    "Capacitors","Thermal resistance","Immune system","Aluminum","Materials","Shape","Cooling"
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology in Electronic Packaging (SIITME), 2012 IEEE 18th International Symposium for
  • Print_ISBN
    978-1-4673-4757-0
  • Type

    conf

  • DOI
    10.1109/SIITME.2012.6384381
  • Filename
    6384381
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3649507