• DocumentCode
    3649657
  • Title

    High Speed Electrical Characterization And Simulation Of A Pin Grid Array Package

  • Author

    T.W. Goodman;H. Fujita;Y.M. Rakami;A.T. Murphy

  • fYear
    1993
  • fDate
    6/15/1905 12:00:00 AM
  • Firstpage
    303
  • Lastpage
    307
  • Keywords
    "Electronics packaging","Circuit testing","Semiconductor device measurement","Pins","Nonhomogeneous media","Probes","Frequency domain analysis","Degradation","Ceramics","Signal processing"
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
  • Print_ISBN
    0-7803-1432-8
  • Type

    conf

  • DOI
    10.1109/IEMT.1993.639776
  • Filename
    639776
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3649657