3649657

High Speed Electrical Characterization And Simulation Of A Pin Grid Array Package

T.W. Goodman;H. Fujita;Y.M. Rakami;A.T. Murphy

1993

6/15/1905 12:00:00 AM

303

307

"Electronics packaging","Circuit testing","Semiconductor device measurement","Pins","Nonhomogeneous media","Probes","Frequency domain analysis","Degradation","Ceramics","Signal processing"

ieee

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

0-7803-1432-8

conf

10.1109/IEMT.1993.639776

639776