DocumentCode
3650929
Title
Sub-micron gap a-Si:H thin film Lamé-mode resonator processed at low temperature on a glass substrate
Author
A. Gualdino;J. Gaspar;V. Chu;J. P. Conde
Author_Institution
INESC-MN, Instituto de Engenharia de Sistemas e Computadores - Microsistemas e Nanotecnologia, Lisbon, Portugal
fYear
2013
fDate
6/1/2013 12:00:00 AM
Firstpage
1484
Lastpage
1487
Abstract
A laterally vibrating square plate fabricated using low temperature (<;250°C) surface micromachining technology and hydrogenated amorphous silicon (a-Si:H) thin films as a structural layer with submicron capacitive actuation gaps has been demonstrated in this work. The resonator is fabricated on a glass substrate by hard mask and deep reactive ion etching processes resulting in transduction gaps of 400 nm. Operating in the Lamé-mode, the resonator vibrates at a frequency of 13.63 MHz with a quality factor as high as 6000 in air. This result represents an important step towards the development of fully miniaturized and monolithically integrated a-Si:H-based MEMS. Using the resonators presented in this work, large-area (on glass and polymer substrates) and CMOS compatible, monolithically integratable thin-film silicon MEMS applications can be envisaged.
Keywords
"Resonant frequency","Q-factor","Electrodes","Micromechanical devices","Substrates","Glass","Capacitance"
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Electronic_ISBN
2164-1641
Type
conf
DOI
10.1109/Transducers.2013.6627061
Filename
6627061
Link To Document