DocumentCode
3652687
Title
Temperature-dependent studies of the electrical properties and the conduction mechanism of HfOx-based RRAM
Author
Chiyui Ahn; Seyoung Kim;Tayfun Gokmen;Oliver Dial;Mark Ritter;H.-S. Philip Wong
Author_Institution
Department of Electrical Engineering, Stanford University, CA 94305, USA
fYear
2014
fDate
4/1/2014 12:00:00 AM
Firstpage
1
Lastpage
2
Abstract
The conduction mechanism of HfOx-based RRAM is investigated by analyzing the I–V characteristics of HfOx-based RRAM devices at different temperatures ranging from 350 K down to 40 K. Electrical conduction of RRAM is found to be strongly dependent on the resistance state of the device, electric field, and temperature. At relatively high electric field (E > 3 MV/cm), Poole-Frenkel conduction explains our measured temperature dependence at limited temperature (T > 200 K) and bias ranges while trap-assisted tunneling accounts for the temperature-insensitive conduction regime (T < 100 K). It is also concluded that the more resistive RRAM device shows weaker dependence on temperature.
Keywords
"Tunneling","Mathematical model","Hafnium compounds","Electric fields","Temperature dependence","Resistance","Equations"
Publisher
ieee
Conference_Titel
VLSI Technology, Systems and Application (VLSI-TSA), Proceedings of Technical Program - 2014 International Symposium on
Type
conf
DOI
10.1109/VLSI-TSA.2014.6839685
Filename
6839685
Link To Document