DocumentCode
3653590
Title
Reliability characterization of a commercial TaOx -based ReRAM
Author
Jean Yang-Scharlotta;Megan Fazio;Mehran Amrbar;Mark White;Douglas Sheldon
Author_Institution
Jet Propulsion Laboratory, Caltech, NASA, Pasadena, California
fYear
2014
Firstpage
131
Lastpage
134
Abstract
We present results of endurance and retention characterization for one of the first commercially available TaOx-based resistive memory chip in room and higher temperature environments. Data retention of the memory chip shows activation energy of 1.13eV and demonstrates an 85°C 10-year data retention even after 250,000 programming cycles. The combined program and read errors were in the range of 10-7 to 10-5 and the memory chip withstood 106 program cycles at 125°C. Overall, the reliability of this commercial resistive memory chip compares well with flash memory.
Keywords
"Computer architecture","Flash memories","Microprocessors","Error analysis","Reliability","Temperature distribution","Writing"
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report (IIRW), 2014 IEEE International
Print_ISBN
978-1-4799-7308-8
Type
conf
DOI
10.1109/IIRW.2014.7049528
Filename
7049528
Link To Document