• DocumentCode
    3653590
  • Title

    Reliability characterization of a commercial TaOx-based ReRAM

  • Author

    Jean Yang-Scharlotta;Megan Fazio;Mehran Amrbar;Mark White;Douglas Sheldon

  • Author_Institution
    Jet Propulsion Laboratory, Caltech, NASA, Pasadena, California
  • fYear
    2014
  • Firstpage
    131
  • Lastpage
    134
  • Abstract
    We present results of endurance and retention characterization for one of the first commercially available TaOx-based resistive memory chip in room and higher temperature environments. Data retention of the memory chip shows activation energy of 1.13eV and demonstrates an 85°C 10-year data retention even after 250,000 programming cycles. The combined program and read errors were in the range of 10-7 to 10-5 and the memory chip withstood 106 program cycles at 125°C. Overall, the reliability of this commercial resistive memory chip compares well with flash memory.
  • Keywords
    "Computer architecture","Flash memories","Microprocessors","Error analysis","Reliability","Temperature distribution","Writing"
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report (IIRW), 2014 IEEE International
  • Print_ISBN
    978-1-4799-7308-8
  • Type

    conf

  • DOI
    10.1109/IIRW.2014.7049528
  • Filename
    7049528