DocumentCode :
3659501
Title :
Efficient don´t-care filling method to achieve reduction in test power
Author :
Sinduja V;Siddharth Raghav; Anita J P
Author_Institution :
Department of ECE, Amrita Vishwa Vidyapeetham, Coimbatore, India
fYear :
2015
Firstpage :
478
Lastpage :
482
Abstract :
Since VLSI technology has become ubiquitous in today´s world, this field is a prime candidate for power reduction. Tremendous growth in chip density and reduction in dimensions contribute to an escalation in clock rate. Delay faults are detected using at-speed scan testing. This paper proposes a novel method to achieve power reduction during scan test by using x-filling. In this paper, ISCAS´89 benchmark circuits have been used with an industrial 90nm technology. The tools used were Synopsys TetraMAX and Synopsys Design Compiler. Experimental results show a considerable reduction in average shift power and average capture power.
Keywords :
"Switching circuits","Switches","Circuit faults","Filling","Testing","Power demand","Power dissipation"
Publisher :
ieee
Conference_Titel :
Advances in Computing, Communications and Informatics (ICACCI), 2015 International Conference on
Print_ISBN :
978-1-4799-8790-0
Type :
conf
DOI :
10.1109/ICACCI.2015.7275654
Filename :
7275654
Link To Document :
بازگشت