Progress on heterogeneous integration: Devices and processes

The heterogeneous integration of compound semiconductors with silicon has been widely studied because of its potential for bringing photonic functionality and improved high-speed performance onto a semiconductor platform with a significant installed manufacturing base. Progress on heterogeneous integration processing methods and devices will be reviewed, and novel methods involving epitaxial transfer and photolithographic optical alignment as a vehicle for producing CMOS-scale electronic-photonic integrated circuits will be discussed. Progress on novel devices such as the light-emitting transistor as a fundamental circuit element for mixed electronic-photonic processing cores will also be presented.