Title :
Heterogeneous system implementation using through-silicon interposer (TSI) technology
Author :
Roshan Weerasekera;Zhang Songbai;Rahul Dutta;Guraprasad Katti;Ka Fai Chang;Jun Zhou;Jong-Kai Lin;Surya Bhattacharya
Author_Institution :
Institute of Microelectronics, A∗
fDate :
6/1/2015 12:00:00 AM
Abstract :
In this paper, we demonstrate a 2.5D/3D IC design methodology adopting 2D traditional IC design tools and show a FPGA-Memory system implementation for TSI. Post layout simulations at 533Mbps (266MHz) shows that the energy consumption of the FPGA-Memory channel is ~6pJ/bit over 20mm long RC interconnects.
Keywords :
"Conferences","Electron devices","Solid state circuits"
Conference_Titel :
Electron Devices and Solid-State Circuits (EDSSC), 2015 IEEE International Conference on
Print_ISBN :
978-1-4799-8362-9
DOI :
10.1109/EDSSC.2015.7285133
