DocumentCode
3664806
Title
Development of silicon electrode neural probe and acute study on implantation mechanics
Author
Songsong Zhang;Merugu Srinivas;Tao Sun;Ming-Yuan Cheng;Yuandong Gu;Chengkuo Lee
Author_Institution
Institute of Microelectronics, Agency for Science, Technology and Research (A∗
fYear
2015
fDate
6/1/2015 12:00:00 AM
Firstpage
683
Lastpage
686
Abstract
The silicon probe with highly P-doped Si electrodes was realized on 8 inch SOI wafer through standard CMOS process. After additional coatings of nano-composite (CNTs + Au nanoparticles) on silicon electrodes, the functionality of neural recording was verified with a low noise level (<; 20 μV) during in vivo recording on rat brain. With built-in silicon nanowires (SiNWs) based piezoresistiors connected in full bridge structure, the capability of monitoring probe mechanical behavior was firstly examined with the probe buckling experiments and further proven through in vivo implantations on rat brain. Besides the large buckling mechanics (during probe insertion), the physiological brain micro-motion (e.g. caused by respiration) was successfully picked up by integrated SiNWs strain sensors. The integrated neural device (including both neural electrode and localized strain sensor) provides the possible research platform to practically understand the correlation between the recorded electrical neural signal and the brain micro-motion.
Keywords
"Electrodes","Probes","Silicon","In vivo","Coatings","Strain","Sensors"
Publisher
ieee
Conference_Titel
Electron Devices and Solid-State Circuits (EDSSC), 2015 IEEE International Conference on
Print_ISBN
978-1-4799-8362-9
Type
conf
DOI
10.1109/EDSSC.2015.7285208
Filename
7285208
Link To Document