DocumentCode
3667901
Title
Thermal simulation of nanosecond laser annealing of 3D sequential VLSI
Author
Benoît Mathieu;Claire Fenouillet-Beranger;Sébastien Kerdiles;Jean-Charles Barbé
Author_Institution
Univ. Grenoble Alpes, CEA, LETI, MINATEC Campus, France
fYear
2015
Firstpage
104
Lastpage
107
Abstract
A framework for the simulation of nanosecond laser annealing of structures found in 3D sequential integration is presented. The framework includes a finite difference frequency domain Maxwell solver and a Poisson solver for the thermal diffusion. Simple applications illustrate the advantages, expected difficulties and optimization levers of this annealing technique.
Keywords
"Silicon","Optical films","Transistors","Temperature","Optical refraction","Optical variables control","Three-dimensional displays"
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices (SISPAD), 2015 International Conference on
ISSN
1946-1569
Print_ISBN
978-1-4673-7858-1
Type
conf
DOI
10.1109/SISPAD.2015.7292269
Filename
7292269
Link To Document