DocumentCode
3667911
Title
Microscopic oxide defects causing BTI, RTN, and SILC on high-k FinFETs
Author
G. Rzepa;M. Waltl;W. Goes;B. Kaczer;T. Grasser
Author_Institution
Institute for Microelectronics, TU Wien, Vienna, Austria
fYear
2015
Firstpage
144
Lastpage
147
Abstract
Reliability issues of MOSFETs such as bias temperature instability (BTI), random telegraph noise (RTN), and stress-induced leakage current (SILC), are linked to the trapping of charges in oxides. Even though the chemical structure of these oxide defects is still the subject of debate, detailed studies of these reliability phenomena have shown that their physical behavior can be successfully described by non-radiative multi-phonon (NMP) theory. In this work we characterize and study a pMOS high-k FinFET technology starting from degradation measurements up to the simulation of the energy barriers in the framework of NMP theory. This allows to investigate the aforementioned reliability issues all based on their common cause, the microscopic oxide defects.
Keywords
"Logic gates","Stress","Voltage measurement","Noise","Charge carrier processes","Reliability","Microscopy"
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices (SISPAD), 2015 International Conference on
ISSN
1946-1569
Print_ISBN
978-1-4673-7858-1
Type
conf
DOI
10.1109/SISPAD.2015.7292279
Filename
7292279
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