Title :
Simulation of plasma immersion ion implantation into silicon
Author :
Alex Burenkov;Juergen Lorenz;Yohann Spiegel;Frank Torregrosa
Author_Institution :
Fraunhofer IISB, Erlangen, Germany
Abstract :
A numerically efficient model for the simulation of ion implantation doping profiles in silicon after pulsed plasma immersion ion implantation is suggested. The model is based on an analytical formula for the energy distribution of the ions extracted from the plasma and on the application of this energy distribution in a Monte-Carlo simulator for conventional ion implantation. The model is verified using examples of BF3 and AsH3 plasmas for p-type and n-type doping in silicon, respectively.
Keywords :
"Plasmas","Semiconductor process modeling","Silicon","Doping profiles","Boron","Numerical models","Ion implantation"
Conference_Titel :
Simulation of Semiconductor Processes and Devices (SISPAD), 2015 International Conference on
Print_ISBN :
978-1-4673-7858-1
DOI :
10.1109/SISPAD.2015.7292298