DocumentCode :
3667929
Title :
Simulation of plasma immersion ion implantation into silicon
Author :
Alex Burenkov;Juergen Lorenz;Yohann Spiegel;Frank Torregrosa
Author_Institution :
Fraunhofer IISB, Erlangen, Germany
fYear :
2015
Firstpage :
218
Lastpage :
221
Abstract :
A numerically efficient model for the simulation of ion implantation doping profiles in silicon after pulsed plasma immersion ion implantation is suggested. The model is based on an analytical formula for the energy distribution of the ions extracted from the plasma and on the application of this energy distribution in a Monte-Carlo simulator for conventional ion implantation. The model is verified using examples of BF3 and AsH3 plasmas for p-type and n-type doping in silicon, respectively.
Keywords :
"Plasmas","Semiconductor process modeling","Silicon","Doping profiles","Boron","Numerical models","Ion implantation"
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices (SISPAD), 2015 International Conference on
ISSN :
1946-1569
Print_ISBN :
978-1-4673-7858-1
Type :
conf
DOI :
10.1109/SISPAD.2015.7292298
Filename :
7292298
Link To Document :
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