Title :
Hierarchical TCAD device simulation of FinFETs
Author :
M. Karner;Z. Stanojević;C. Kernstock;H.W. Cheng-Karner;O. Baumgartner
Author_Institution :
Global TCAD Solutions GmbH, Landhausgasse 4/1A, 1010 Wien, Austria
Abstract :
A framework for FinFET design studies is presented. Our physics-based modeling approach allows to accurately capture the effects of channel cross-section, orientation and strain as well as contact resistance - for the first time all in one tool. Using this approach as a reference, the predictiveness of empirical TCAD models is extended by re-calibration. Our hierarchical tool chain is embedded in an industry-proven framework equipped with DOE and optimization modules. The capabilities are demonstrated in a simulation study on a recent FinFET technology node.
Keywords :
"Mathematical model","Computational modeling","Semiconductor process modeling","Optimization","Predictive models","FinFETs","Stress"
Conference_Titel :
Simulation of Semiconductor Processes and Devices (SISPAD), 2015 International Conference on
Print_ISBN :
978-1-4673-7858-1
DOI :
10.1109/SISPAD.2015.7292308