DocumentCode :
3669960
Title :
Effects of thermal aging on the characteristic breakdown behavior of Nano-SiO2-BOPP and BOPP films
Author :
M. Ritamäki;I. Rytöluoto;K. Lahti;M. Karttunen
Author_Institution :
Department of Electrical Engineering, Tampere University of Technology (TUT), Finland
fYear :
2015
fDate :
7/1/2015 12:00:00 AM
Firstpage :
400
Lastpage :
403
Abstract :
The effects of thermal stress on the breakdown behavior of biaxially oriented polypropylene (BOPP)-silica nanocomposite thin film and commercial BOPP film was evaluated with a step stress experiment in the temperature range of 50...110 °C. Weak spots were measured in thermally aged unfilled BOPP films but not in the PP-silica, which in turn displayed increasing scatter of the breakdown voltages and the scattering seemingly settled to a certain level. No weak spots were measured in un-filled BOPP films removed after highest temperatures. The behavior of un-filled films is speculated to result from either actual polymer aging in addition to the statistical nature of breakdown phenomena or from thermally-activated processes possibly involving antioxidants. The different behavior in the nanocomposite was speculated to result from polymer-nanoparticle interactions possibly countering the effects of antioxidants and hindering weak spot formation. The results demonstrate the different behavior of polymer-nanocomposites and traditional BOPP films under thermal stress and highlight the importance of evaluating the aging behavior of new materials.
Keywords :
"Films","Electric breakdown","Temperature measurement","Aging","Dielectric measurement","Stress","Polymers"
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials (ICPADM), 2015 IEEE 11th International Conference on the
Electronic_ISBN :
2160-9241
Type :
conf
DOI :
10.1109/ICPADM.2015.7295293
Filename :
7295293
Link To Document :
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